Dissipatore/radiatore Supermicro SNK-P0049P per Intel Xeon E3, LGA1155, 1U, TDP 95 W, alluminio

The Supermicro SNK-P0049P is a passive 1U CPU heat sink compatible with LGA1150 and LGA1155 sockets. Designed for use in Supermicro X9, X10 and X11 generation 1U single-processor (UP) servers, it provides reliable thermal dissipation for 8th/9th generation Intel Core processors including Core i9, i7, i5, i3, as well as Pentium and Celeron CPUs. The unit is constructed from aluminum for effective heat transfer and has been tested and validated by Supermicro for fit and cooling performance.

Advantages

The SNK-P0049P offers a compact 1U form factor suitable for dense rack environments, passive operation that reduces moving parts and potential failure points, and aluminum construction that balances weight and thermal conductivity. Validation by the manufacturer ensures compatibility with specified Supermicro server platforms and predictable cooling behavior under typical server loads.

Suitable for

• 1U Supermicro X9/X10/X11 single-socket servers
• Systems using LGA1150 or LGA1155 Intel processors (8th/9th gen Core, Pentium, Celeron)
• Environments where passive cooling and low-maintenance components are preferred

Key specifications

• Model: SNK-P0049P
• Form factor: 1U passive heatsink
• Material: Aluminum
• Socket compatibility: LGA1150 / LGA1155
• Supported platforms: Supermicro X9, X10, X11 1U UP servers

How to use

Install the SNK-P0049P onto the server CPU socket following Supermicro’s assembly and mounting instructions for 1U passive heatsinks. Ensure the processor surface is clean and apply the appropriate thermal interface material before seating the heat sink. Tighten fasteners evenly to the recommended torque and verify that the heatsink is securely mounted and unobstructed by other components to allow proper airflow through the server chassis.

Recommendations

Use this passive heatsink in chassis and system configurations validated by Supermicro for X9/X10/X11 1U servers. Monitor system temperatures under expected load to confirm adequate cooling, and combine with proper chassis airflow (front-to-back fans and unobstructed air channels) for best results.