Dissipatori per chip IC InLine, alette di raffreddamento autoadesive, 8 pz.

InLine 33955I heatsinks are compact passive cooling fins supplied in a pack of 8, designed to dissipate heat from IC chips and other small electronic components. Each aluminium heatsink measures 14 x 14 x 6 mm and comes with a pre-attached thermally conductive self-adhesive pad for straightforward placement and good thermal contact. The silver finish provides a neutral appearance suitable for a variety of electronics assemblies.

Advantages

The small size and lightweight aluminium construction enable placement on tight boards without adding significant mass. Pre-applied thermal conductive adhesive pads simplify installation and ensure stable contact with chip packages. Being passive, these heatsinks require no power or moving parts, offering silent, maintenance-free heat dissipation.

Suitable for

Key specifications

How to use

Ensure the component surface is clean, dry and free of oils or flux. Peel off the protective film from the adhesive pad and press the heatsink firmly onto the chip, centring it for maximum contact. Apply steady pressure for a few seconds to secure adhesion. Allow any adhesive curing time recommended by the device or adhesive manufacturer before powering the device.

Recommendations

For best results, use these heatsinks on flat, exposed chip packages with sufficient board clearance. Avoid placing them on components that require insulation from the board or on very tall components that may interfere with nearby connectors. If higher heat dissipation is required, consider combining with improved airflow or a larger heatsink solution.