Intamsys nastro Kapton INTAMSYS ACCESSORI 3D

For high-temperature 3D printing, ordinary tapes fail quickly, but this INTAMSYS Kapton tape delivers reliable bed adhesion up to 260°C continuous and 400°C short-term. Its polyimide film with silicone adhesive provides a smooth, non-stick surface after cooling, making part removal effortless while preventing warping on demanding materials like ABS, PC, and nylon. The 200mm width covers large build plates of FUNMAT PRO series printers efficiently.

Highlights

• High-temperature polyimide film withstands up to 260°C continuous, 400°C short-term
• Silicone adhesive offers excellent tack at elevated temperatures and clean removal
• Non-stick surface after cooling allows easy part release without residue
• Wide 200mm format reduces seams and application time on large beds
• Chemical and UV resistant for long service life in demanding environments

In daily use

Applying the tape is straightforward: clean the build plate, lay down the tape smoothly, and trim excess. The silicone adhesive holds firmly during printing but releases parts easily once cooled, reducing the risk of damage. The amber translucent film allows visual inspection of the bed surface, and its dielectric strength makes it safe for use with heated beds and sensors.

Full specifications

• Tape material: Polyimide film (Kapton)
• Adhesive material: Silicone
• Width: 200 mm
• Length: 30 m
• Thickness: 0.06 mm (60 microns)
• Continuous operating temperature: up to 260 °C
• Short-term temperature resistance: up to 400 °C
• Dielectric strength: >5 kV/mm
• Adhesion strength: 6 N/25mm
• Tensile strength: 120 N/25mm
• Elongation at break: 50%
• Core diameter: 76 mm (3 inch)
• Colour: Amber / translucent brown
• Compatibility: INTAMSYS FUNMAT PRO series and other high-temperature FDM/FFF printers

Final note

This Kapton tape is an essential consumable for anyone printing high-temperature filaments, ensuring consistent adhesion and easy part removal without damaging the build surface.