Samsung HPI molla CS SUS PI0.4 D3.9 L13 OD4.3 (6107-001163)

This Samsung HPI Series compression spring stands apart from generic springs through its precision engineering and use of high-grade stainless steel (SUS). With a wire diameter of just 0.4 mm and an outer diameter of 4.3 mm, it is tailored for compact electronic assemblies where space is at a premium and consistent force is critical. The spring's free length of 13 mm and mean coil diameter of 3.9 mm provide a balanced spring rate for reliable actuation in switches, connectors, and other mechanisms.

Highlights

• Material: Stainless Steel (SUS) for excellent corrosion resistance and durability
• Wire Diameter: 0.4 mm – fine gauge for precision applications
• Outer Diameter: 4.3 mm – compact footprint
• Free Length: 13 mm – suitable for limited space designs
• Mean Coil Diameter: 3.9 mm – optimized for consistent compression
• High heat resistance – maintains performance in elevated temperatures
• Natural stainless steel finish – no coating, ideal for clean environments

In daily use

Whether you are repairing a Samsung electronic device or manufacturing a new product, this spring delivers repeatable performance. Its high precision ensures minimal variation between cycles, reducing the risk of mechanical failure. The corrosion-resistant stainless steel construction makes it suitable for both indoor and challenging environments, while the smooth surface finish prevents snagging or wear on adjacent components.

Full specifications

• Brand: Samsung
• Model: HPI Spring CS SUS PI0.4 D3.9 L13 OD4.3
• Manufacturer Part Number: 6107-001163
• Spring Type: Compression Spring
• Material: Stainless Steel (SUS)
• Wire Diameter: 0.4 mm
• Outer Diameter (OD): 4.3 mm
• Inner Diameter (ID): 3.5 mm
• Mean Coil Diameter: 3.9 mm
• Free Length: 13 mm
• Finish: Natural (Stainless Steel)
• Corrosion Resistance: High
• Heat Resistance: Good
• Durability: High
• Precision: High
• Intended Use: Electronic Device Repair/Manufacturing

Final note

For technicians and engineers who demand exact OEM specifications, this Samsung HPI spring offers the reliability and consistency needed for critical applications. Its compact size and robust material make it a versatile choice for a wide range of electronic and mechanical designs.