Cimco 150154 filo per saldatura senza piombo Sn99.3Cu0.7 1,0mm 250g DIN EN 29453-4

For electronics soldering that demands a clean, reliable joint without the health and environmental concerns of lead, this Cimco 150154 solder wire delivers a lead-free alloy in a convenient 250 g disposable spool. The Sn99.3Cu0.7 composition melts at approximately 227 °C, making it compatible with all common lead-free soldering irons. Its no-clean, halogen-free flux leaves minimal, non-corrosive residue, so you can skip aggressive board washing after rework. The 1.0 mm diameter suits through-hole and larger SMD pads where a bit more solder volume speeds up the job.

Highlights

• Lead-free alloy: 99.3 % tin, 0.7 % copper
• No-clean, halogen-free flux with 2.5 % content
• Low smoke emission and low odor during soldering
• Meets DIN EN 29453-4
• Disposable spool: 250 g

In daily use

Because the flux residue is non-corrosive and electrically safe, you can leave it on the board without risking long-term reliability. The wire feeds smoothly from the spool, and the 1.0 mm diameter gives good control when bridging or tinning. Whether you are assembling prototypes, repairing consumer electronics, or making electrical connections, this solder produces bright, mechanically strong joints.

Full specifications

• Alloy: Sn99.3Cu0.7
• Wire diameter: 1.0 mm
• Spool weight: 250 g
• Flux type: No-clean, halogen-free
• Flux content: 2.5 %
• Melting point: approx. 227 °C
• Standard: DIN EN 29453-4
• Specific gravity: approx. 7.3 g/cm³
• Tensile strength: approx. 30 N/mm²

Final note

Lead-free soldering with a no-clean flux that leaves minimal, non-corrosive residue — ideal for electronics work where board washing is not practical.