Stagno per saldatura GOOBAY senza piombo 0,56 mm 100 g – con flussante, lega a base Sn

GOOBAY Lead-Free Solder Wire 0.56 mm, 100 g is a flux-cored, tin-based alloy designed for electronics and electrical repairs where a lead-free material is required. The wire contains 99% tin, 0.3% silver and 0.7% copper, with a 2.5% rosin flux core and a melting point of 217°C. Supplied on a 100 g spool, the thin 0.56 mm diameter provides consistent feed for manual soldering and small maintenance tasks on circuit boards, components and connector joints.

Advantages

The flux-cored construction simplifies soldering by combining solder and flux in one product, enabling homogeneous wetting and reduced spattering. The low-diameter wire supports precise application on small components and SMD pads, while the halogen-free formulation with low smoke emission improves workplace safety. The alloy composition offers reliable solder joints at relatively low temperatures for soft soldering in both hand and small automated operations.

Suitable for

• Soldering and rework of PCBs and circuit boards
• SMD and DIP component soldering
• Repairing cables, connectors and joints
• Maintenance of audio devices such as headphones and microphones
• Consumer electronics repair including televisions and small appliances

Key specifications

• Wire diameter: 0.56 mm
• Spool weight: 100 g
• Alloy composition: approximately 99% tin, 0.3% silver, 0.7% copper
• Flux core content: 2.5% rosin (no-clean)
• Melting point: 217°C
• Halogen-free with low smoke emission

How to use

Prepare the soldering iron and set the tip temperature appropriate for the component and board mass, typically slightly above the alloy melting point. Clean the joint area to remove dirt or oxidation. Apply the soldering iron to the pad and lead or wire, then feed the flux-cored solder wire to the heated joint so the solder melts and flows to create a smooth fillet. Remove heat once the solder has wetted the surfaces and allow the joint to cool undisturbed. If stronger mechanical support is required, use appropriate soldering techniques or additional mechanical fixation before soldering.

Recommendations for use

Use adequate ventilation when soldering to minimize exposure to fumes. Choose a soldering tip size and iron temperature matched to the 0.56 mm wire and to the component thermal mass. For critical or high-reliability joints, inspect solder wetting and consider flux removal if contaminants are present despite the no-clean flux core. Store the spool in a dry place to preserve flux performance.