Dissipatore Dynatron Q1 — rame, 90×90×27 mm, per LGA 1700, 130 W TDP

Dynatron Q1 is a compact copper heatsink/radiator measuring 90×90×27 mm designed for passive cooling of processors on LGA 1700 sockets. With a rated thermal design power (TDP) of 130 W and a total weight of 0.49 kg, the Q1 provides reliable heat dissipation in low-profile and space-constrained systems such as 1U chassis, compact workstations and embedded platforms where active fans are not desirable or possible.

Advantages

The copper construction delivers effective thermal conductivity for passive heat transfer without moving parts. Its compact footprint and low height make the heatsink suitable for confined installation spaces while supporting a relatively high TDP for passive cooling scenarios. The product's form factor and material selection prioritize durability and steady-state thermal performance in continuous-operation environments.

Suitable for

• Small-form-factor servers and 1U rack systems
• Embedded systems and industrial controllers
• Compact workstations with limited internal clearance
• Fanless designs and noise-sensitive applications

Key specifications

• Type: Heatsink / radiator
• Material: Copper
• Dimensions: 90 × 90 × 27 mm
• Rated thermal design power (TDP): 130 W
• Supported processor socket: LGA 1700
• Weight: 0.49 kg
• Colour: Copper finish

How to use

Install the Dynatron Q1 on a compatible LGA 1700 motherboard following the motherboard and chassis manufacturer's mounting instructions. Ensure the processor and heatsink contact surfaces are clean; apply a thin, even layer of thermal interface material between the CPU heatspreader and the heatsink base to promote thermal transfer. Secure the heatsink using the appropriate retention mechanism or mounting hardware for the platform, verifying even pressure and correct alignment. Ensure adequate chassis airflow or ambient conditions suitable for passive cooling to maintain processor temperatures within specification.

Recommendations

Use the Dynatron Q1 in systems where passive cooling is intended; confirm that system workload and ambient temperature do not exceed the heatsink's 130 W TDP capability. For higher sustained processor power, consider supplemental airflow or an active cooling solution. Periodically inspect and clean contact surfaces and surrounding airflow paths to maintain optimal thermal performance.