LOGILINK filo di stagno senza piombo 1mm 100g Sn99.3Cu0.7 flussante No-Clean

This LOGILINK soldering wire delivers exceptional wetting speed and a low-smoke, low-odor experience, thanks to its Sn99.3Cu0.7 alloy with a 3.5% no-clean, halogen-free flux core. The 1mm diameter is ideal for general electronics, manual, and robotic soldering applications.

Overview

Engineered for reliability, this lead-free solder wire ensures strong, electrically conductive joints with minimal residue. The transparent, non-corrosive residue eliminates the need for post-soldering cleaning, saving time and effort. Its fast wetting action promotes efficient soldering, while the plastic spool keeps the wire tangle-free and easy to handle.

What stands out

• Lead-free composition (Sn99.3Cu0.7) meets RoHS and REACH standards.
• No-clean, halogen-free flux reduces residue and simplifies workflow.
• Fast wetting speed enhances productivity in manual and robotic soldering.
• Low smoke and low odor improve working conditions.
• High electrical conductivity ensures reliable connections.

Technical details

• Alloy: Sn99.3Cu0.7
• Wire diameter: 1.0 mm
• Net weight: 100 g
• Flux content: 3.5%
• Melting point: 227 °C
• Specific gravity: 7.31 g/cm³
• Tensile strength: 30-40 MPa
• Residue: Transparent, minimal, non-corrosive
• Compliance: RoHS, REACH

Our verdict

For professionals and hobbyists alike, this solder wire offers a perfect balance of performance and convenience. Its no-clean formulation and fast wetting make it a dependable choice for everyday soldering tasks.