LogiLink filo per saldatura, senza piombo, Sn99.3Cu0.7, 1 mm, 12,5 g scatola dosatrice

With a melting point of just 227°C, this lead-free solder wire flows smoothly and solidifies quickly, giving you clean, reliable joints on every electronics project. The LogiLink SA0010 delivers professional-grade results in a compact dispenser box that keeps your workspace tidy and your solder protected.

Overview

Engineered for precision electronics soldering and rework, this solder wire features a Sn99.3Cu0.7 alloy that is fully compliant with RoHS and REACH directives. The 1.0 mm diameter is ideal for through-hole and larger SMD components, while the no-clean synthetic resin flux leaves a transparent, non-corrosive residue that eliminates the need for post-solder cleaning. With a flux content of 2.5% and halogen-free formulation, it meets the strictest environmental and safety standards.

What stands out

• Lead-free alloy Sn99.3Cu0.7 with a low melting point of 227°C for fast, efficient soldering.
• No-clean, halogen-free flux classified as ROL0 per J-STD-004, leaving clear, non-corrosive residues.
• Convenient 12.5 g dispenser box with a small spool for easy handling and storage.
• Excellent wetting and solderability on copper, brass, and tin-plated surfaces.
• Low odor and low spattering for a comfortable working environment.
• Compliant with RoHS and REACH, and backed by a 2-year shelf life.

Technical details

• Alloy composition: Sn99.3Cu0.7
• Wire diameter: 1.0 mm
• Wire weight: 12.5 g
• Flux type: Synthetic resin, no-clean
• Flux content: 2.5%
• Halogen-free: Yes
• Melting point: 227 °C
• Specific gravity: 7.3 g/cm³
• Flux classification: ROL0 (J-STD-004)
• Residue: Transparent, non-corrosive
• Packaging: Dispenser box (small spool)
• Shelf life: 2 years

Our verdict

For hobbyists and professionals who demand clean, reliable solder joints without the hassle of cleaning, the LogiLink SA0010 is an outstanding choice. Its lead-free, no-clean formula and convenient packaging make it a staple for any electronics workbench.