Set dissipatori ALLNET FriendlyELEC NanoPi Neo / Neo2, 20 pezzi – raffreddamento passivo per single board computer

Heatsink set ALLNET FriendlyELEC NanoPi Neo / Neo2, 20 pieces provides a simple, passive cooling solution for FriendlyELEC NanoPi Neo and NanoPi Neo2 single-board computers. The set contains twenty compact aluminum heatsinks sized to fit processors and nearby power components on these boards. Designed for hobbyists, prototypers and small-series manufacturers, the heatsinks improve thermal dissipation without adding moving parts or requiring additional mounting hardware beyond adhesive pads.

Advantages

The heatsinks are made of lightweight aluminum to offer efficient heat transfer while keeping added weight minimal. Their passive design enables maintenance-free operation with no noise and no power draw. Supplied in a 20-piece bulk pack, the set supports multiple builds or batch assembly, offering consistent thermal performance across units. Adhesive backing simplifies attachment and reduces assembly time compared with screw-mounted solutions.

Suitable for

• Cooling CPU and SoC components on FriendlyELEC NanoPi Neo and NanoPi Neo2
• Thermal management of power regulators and MOSFETs on small single-board computers
• Hobby electronics projects and prototyping with NanoPi Neo/Neo2
• Small-series production runs and batch assembly where space and noise are limited

Key specifications

• Quantity: 20 heatsinks per pack
• Material: aluminum (passive thermal conductor)
• Mounting method: adhesive backing for direct attachment
• Form factor: compact, low-profile designed for NanoPi Neo / Neo2 board component layout
• Operation: passive cooling (no fan required)

How to use

Before attaching a heatsink, clean the target component surface with isopropyl alcohol and ensure it is dry. Remove the protective film from the adhesive backing and position the heatsink over the processor or component, applying firm pressure for a few seconds to secure adhesion. Allow a short curing time if recommended by the adhesive manufacturer. Place heatsinks only on flat, accessible component surfaces and avoid covering connectors or obstructing board installation in cases or enclosures.

Recommendations

Choose heatsink sizes that match the component footprint and ensure good surface contact. For applications with sustained high load, combine passive heatsinks with improved airflow in the enclosure. Verify clearances for GPIO headers and nearby connectors before final placement. Store unused heatsinks in a dry environment to preserve adhesive quality.